| PART |
Description |
Maker |
| SOD80C FOOTPRINT-SOD80C |
PC board footprint
|
PHILIPS[Philips Semiconductors]
|
| 74337-0072 |
0.80mm (.031) Pitch Ultra VHDCI Wire-to-Board Receptacle, Stacked, Right Angle,with Enhanced Shield, Version 1 Footprint, 136 Circuits
|
Molex Electronics Ltd.
|
| 82547GI |
Dual Footprint
|
Intel Corporation
|
| MA4E2513L-1289W MA4E2513 MA4E2513-1289 MA4E2513L-1 |
SURMOUNT Low Barrier Tee ?301 Footprint Silicon Schottky Diodes
SURMOUNT Low Barrier Tee “0301” Footprint Silicon Schottky Diodes
|
MACOM[Tyco Electronics]
|
| 22-43-8100 A-42267-10A |
2.50mm (.098) Pitch SPOX Header, Shrouded, In-line Footprint, 10 Circuits, White
2.50mm (.098") Pitch SPOX垄芒 Header, Shrouded, In-line Footprint, 10 Circuits, White
|
Molex Electronics Ltd.
|
| BXB75-48S12FLTJ BXB75-48S05FLTJ BXB75-48S3V3FLTJ |
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
|
Emerson Network Power
|
| BXB50 BXB50-24S12FLTJ BXB50-24S3V3FLTJ BXB50-24S15 |
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
|
Emerson Network Power
|
| KP3528F00C8I |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| BGU7003 BGU7004 BGU7005 BGU7007 BGU7008 BGU8007 |
The best reception of GNSS signals with the smallest footprint
|
NXP Semiconductors
|
| KP3812W00A16 |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| KP1504WW0 |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| 0022436140 22-43-6140 A-42249-14A |
2.50mm (.098) Pitch SPOX?/a> Header, Shrouded, Staggered Footprint, 14 Circuits, White
2.50mm (.098) Pitch SPOX Header, Shrouded, Staggered Footprint, 14 Circuits, White
MOLEX Connector
|
Molex Electronics Ltd.
|
